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Kategori
Atribut
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Perusahaan
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Electronic Component
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Universal
Electronic Component
Rincian
Atribut
7
Perubahan
0
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Kategori ini
Nama
Jenis
Masker / Rentang nilai
Ukur
Component case and mounting
Component package type
DIP
SOIC
SOP
SSOP
TSSOP
QFN
DFN
QFP
LQFP
TQFP
BGA
LGA
CSP
WLCSP
SOT
TO
Axial
Radial
Chip
Module
Bare die
Mounting technology
SMD
Through-hole
Socket
Connector-mounted
Panel-mounted
Pin/contact count
N
0 - 999999
item piece
Component physical and environment
Length
N
0 - 1000000000000
L mm
Width
N
0 - 1000000000000
L mm
Thickness
N
0 - 1000000000000
L mm
Operating temperature range
N
-999999999999,99 - 999999999999,99
t C°
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